MULTI-LAYER PRINTED CIRCUIT BOARD ANC SEMICONDUCTOR PACKAGE HAVING THE SAME

摘要

A multi-layer printed circuit board and a semiconductor package including the same are provided to improve impedance characteristic compared to a total composite dielectric thickness and signal and power transfer characteristic by forming a composite dielectric as a double layer. A first conductive layer(110) is formed as a signal wire. A second conductive layer(120) is arranged on an upper portion of the first conductive layer to be formed as a first power wire. A third conductive layer(130) is arranged on an upper portion of the second conductive layer to be formed as a second power wire. A single dielectric(125) is formed between the second and third conductive layers as a single layer. A composite dielectric(115) is formed between the first and second conductive layers as a double layer. The composite dielectric has a thickness two times thicker than the single dielectric.