| 摘要 |
A method for fabricating a semiconductor device includes mountain a first semiconductor chip on a wiring substrate, bonding a spacer having a first main surface and a second main surface opposing the first main surface such that the first main surface is in contact with the first semiconductor chip. The method further includes bonding a second semiconductor chip having a surface, onto the second main surface via a layer of a die bonding material selectively formed on a part of a third main surface. |
