发明名称 |
BALANCER, HEAD STACK ASSEMBLY WITH THE SAME, AND METHOD FOR MANUFACTURING THE BALANCER AND OVERMOLD OF THE HEAD STACK ASSEMBLY |
摘要 |
A balancer, an HSA(Head Stack Assembly) with the same, a method for manufacturing the balancer, and a method for manufacturing an overmold of the HSA are provided to be inexpensive at manufacturing cost by being formed as a stainless steel and prevent the generation of interference with a magnet by being reduced to paramagnetism by a demagnetization thermal process. A balancer is mounted in an overmold(145) of an HSA(130) to adjust the balance of the HSA(130). The balancer is formed as a stainless steel, and is demagnetized through a thermal process after a shape is processed. In the demagnetization thermal process, the stainless steel is left alone during 30 to 120 minutes in temperature among 950 to 1150 °C. When the balancer is laid in a mold for molding the overmold(145), a groove is formed in an upper surface or a lower surface to set the laid position.
|
申请公布号 |
KR100744129(B1) |
申请公布日期 |
2007.07.24 |
申请号 |
KR20060012880 |
申请日期 |
2006.02.10 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SHIN, SANG CHUL;JEONG, WOO CHEOL |
分类号 |
G11B21/16;G11B5/48;G11B5/58;G11B21/24 |
主分类号 |
G11B21/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|