发明名称 |
OVERMOLDED OPTICAL PACKAGE |
摘要 |
An optical semiconductor package includes a substrate, a chip, a plurality of bonding wires, a window, a supporter, and an encapsulant. The chip is disposed on the substrate and has an optical element. The bonding wires are used for electrically connecting the chip to the substrate. The window is supported on the supporter and positioned over the optical element of the chip. The encapsulant is overmolded on the substrate for fixing the window and encapsulating the chip and the bonding wires. |
申请公布号 |
US2007166866(A1) |
申请公布日期 |
2007.07.19 |
申请号 |
US20070686748 |
申请日期 |
2007.03.15 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
APPELT BERND K.;CHEN WILLIAM T. |
分类号 |
H01L21/00;H01L23/433;H01L31/0203;H01L31/0232 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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