| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve electrical reliability of a mounting structure by controlling generation of fault in conductor connection resulting from drop in bonding force of an insulating resin, in the mounting structure including a substrate and an electronic component bonded with the insulating resin, or in an electro-optixcal apapratus provided with the same mounting structure. <P>SOLUTION: The electro-optical apparatus 100 comprises a substrate 111 on which an electro-optical substance is arranged, and an electronic component 120 mounted on the substrate. In this electro-optical apparatus 100, conductors 117a, 118a provided on the substrate and an electrode 124 provided to the electronic component are in the conductive connection directly or indirectly, and the substrate and the electronic component are bonded with an insulating resin 119A. Moreover, a filler 119f is mixed into the insulating resin. Here, the filler 119f is formed of a raw material having a thermal expansion coefficient which is nearer than that of a resin base material 119a forming an insulating resin, for the thermal expansion coefficient of the part to which the substrate or insulating resin of the electronic component is bonded. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
