| 发明名称 |
RECYCLYING FAULTY MULTI-DIE PACKAGES |
| 摘要 |
<p>The present invention teaches the recycling of a faulty multi-die memory package by isolating the functional part of the package and using it as a smaller memory package.</p> |
| 申请公布号 |
WO2007080573(A2) |
申请公布日期 |
2007.07.19 |
| 申请号 |
WO2007IL00020 |
申请日期 |
2007.01.08 |
| 申请人 |
MSYSTEMS LTD.;MEIR, AVRAHAM |
发明人 |
MEIR, AVRAHAM |
| 分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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