发明名称 RESIN COMPOSITION CONTAINING POROUS STRUCTURE
摘要 PROBLEM TO BE SOLVED: To solve problems that in the case of using hollow glass having a diameter of about 100μm and a void fraction of 70% or more, the thickness of the glass becomes thin and the glass is broken on kneading with a resin and that a silica gel foam is hardly compatible with particularly a hydrophobic resin such as a polyolefin resin to render a resin composition comparatively brittle since the surface of the silica gel foam has become hydrophilic. SOLUTION: By kneading a porous structure having mesopores and a void fraction of 70-99.5% obtained by preparing wet gel by the sol-gel process, hydrophobicizing the surface of the prepared wet gel, and then removing the water content and a solvent within the wet gel to dry it as a filler with a resin, a resin which is very light and has high heat insulation properties and strength can be realized and can be used in various products whose resin is required of lightweight or heat insulation properties such as cleaners, refrigerators, electric water heaters, rice cookers, and toilet seats with a warm water bidet. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007182490(A) 申请公布日期 2007.07.19
申请号 JP20060001138 申请日期 2006.01.06
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SANO MITSUHIRO
分类号 C08J9/26 主分类号 C08J9/26
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