| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a compact composite wiring board reducing the characteristic dispersion even when a functional ceramic layer such as a high dielectric-constant layer, a magnetic layer or the like is formed in a board, simultaneously attaining the thinning of the thickness of an insulating layer and the thickening of the thickness of a wiring conductor layer, and having a high performance and a manufacturing method for the composite wiring board. <P>SOLUTION: The wiring board has at least insulating ceramic layers, the functional ceramic layer composed of the quality of material different from the insulating ceramic layers, wiring electrode layers, and wiring circuit layers electrically connected to the wiring electrode layers. In the wiring board, a plurality of the insulating ceramic layers are laminated, and the functional ceramic layer is formed so as to be penetrated to the insulating ceramic layers. In the wiring board, the wiring electrode layers hold the functional ceramic layer and are formed inside boundaries among the insulating ceramic layers and the functional ceramic layer on the main surface of the functional ceramic layer. The manufacturing method is provided for the wiring board. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
