| 摘要 |
A semiconductor package may include a semiconductor chip assembly, a signal input/output member and an encapsulating member. The semiconductor chip assembly may include first pads and second pads. The first pads may be exposed in a first direction. The second pads may be exposed in a second direction substantially opposite to the first direction. The signal input/output member may include first terminals and second terminals. The first terminals may be electrically connected to the first pads. The second terminals may be electrically connected to the second pads. The encapsulating member may encapsulate the semiconductor chip assembly.
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