发明名称 MANUFACTURING METHOD OF BOARD FOR PIEZOELECTRIC DEVICE, BOARD FOR PIEZOELECTRIC DEVICE, AND SURFACE ACOUSTIC WAVE DEVICE USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To obtain the propagation rate with little scattering while there are few defects or the like in the crystal in a manufacture method of a board for a piezoelectric device, the board for the piezoelectric device, and a surface acoustic wave device using this. <P>SOLUTION: The manufacturing method of the board for the piezoelectric device comprises: growing a La<SB>3</SB>Ga<SB>5</SB>SiO<SB>14</SB>single crystal; and processing it into the board for the piezoelectric device, wherein the weighing is carried out in the composition range that La<SB>2</SB>O<SB>3</SB>is from 48.06 to 48.80 wt.%, Ga<SB>2</SB>O<SB>3</SB>is from 45.25 to 46.60 wt.% and SiO<SB>2</SB>is from 5.21 to 6.19 wt.%, the weighed object is molten in a crucible 1, and the single crystal C of La<SB>3</SB>Ga<SB>5</SB>SiO<SB>14</SB>is pulled from the crucible and grown. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007176794(A) 申请公布日期 2007.07.12
申请号 JP20070062619 申请日期 2007.03.12
申请人 MITSUBISHI MATERIALS CORP 发明人 O SHUKI;UDA SATOSHI
分类号 C30B29/34;C01B33/20;C30B15/00;H01L41/09;H01L41/18;H01L41/39;H01L41/41;H03H3/08;H03H9/25 主分类号 C30B29/34
代理机构 代理人
主权项
地址