| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that vibration of a piezoelectric vibration chip is inhibited by the fact that the piezoelectric vibration chip is tightly fixed to a frame via a connection part when the piezoelectric vibration chip becomes extremely small and consequently, deterioration in piezoelectric device characteristics is caused by an increase in a crystal impedance (CI) value, etc. in a piezoelectric device manufactured by utilizing a piezoelectric vibrator having the piezoelectric vibration chip integrally connected to the frame. SOLUTION: This method for manufacturing the piezoelectric device is provided, which joins the piezoelectric vibrator in which the piezoelectric vibration chip and the frame are integrally formed via the connection part by associating a wiring electrode formed in a substrate member with a connection electrode formed in the piezoelectric vibration chip, electrically and mechanically connects the substrate member with the piezoelectric vibrator and joins a cap to an upper surface of the frame to seal the piezoelectric vibrator after separating the piezoelectric vibration chip from the frame by cutting the connection part of the piezoelectric vibrator. COPYRIGHT: (C)2007,JPO&INPIT
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