Electronic device and method for bonding an electronic device

摘要

An electronic device ( 1 ) has a base plate ( 2 ) and an electronics housing ( 3 ) connected thereto, with a bond contact bearer ( 5 ). The latter rests on the base plate ( 2 ) via a supporting body ( 6 ) in such a manner that the supporting body ( 6 ) exerts a pretension force onto the bond contact bearer ( 5 ). Due to the support of the bond contact bearer ( 5 ) in the close vicinity, its position is well defined during the bonding procedure. A secure bond is the result.