NOVEL POLISHING SLURRIES AND ABRASIVE-FREE SOLUTIONS HAVING A MULTIFUNCTIONAL ACTIVATOR
摘要
The present invention relates to aqueous slurry/solution compositions for the Chemical Mechanical Polishing/Planarization ("CMP") of substrates. In particular, the novel slurries/solutions of the present invention contain a multifunctional activator which provides increased copper removal rate to the aqueous polishing slurry/solution while suppressing isotropic chemical etch and dishing of copper lines.
申请公布号
WO2006081149(A3)
申请公布日期
2007.07.12
申请号
WO2006US02139
申请日期
2006.01.23
申请人
PRAXAIR S. T. TECHNOLOGY, INC.;BELOV, IRINA;MOSER, TIMOTHY, D.