发明名称 METHOD FOR PROCESSING INSIDE HOLE OF HOLLOW BRITTLE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a method for processing the inside hole of a hollow brittle material which is superior in grinding capacity and grinding straightness even when an object to be ground is relatively lengthy and prevents the object from being damaged when the inside hole before being processed of the hollow brittle material is ground. SOLUTION: In the method for processing the inside hole, with the use of a hollow brittle material processing drill which is composed of a drill rod rotating around the axis in the longitudinal direction and a drill head set at the front end of the drill rod and in which the drill head has a head drill body having a plurality of head grindstone chips set at equal intervals on the periphery of a head disk body, and the widths of the head grindstone chips are 4-10 mm, the inside diameter of the inner peripheral surface of the inside hole before being processed of the hollow brittle material is expanded/ground by a prescribed size. The contact area of the head grindstone chips in relation to the inside hole of the hollow brittle material is regulated to be 5-80 mm<SP>2</SP>. In the processing, the dislocation of the circle center of the average inside diameter in relation to the circle center of the average outside diameter of the ground hollow brittle material is made to be 1.0 mm or below. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007175967(A) 申请公布日期 2007.07.12
申请号 JP20050375875 申请日期 2005.12.27
申请人 SHINETSU QUARTZ PROD CO LTD 发明人 SHIMADA ATSUSHI;MOTOYAMA YUSUKE;TSUBURAYA TAKEO
分类号 B28D1/14;B24D3/00;B24D7/18 主分类号 B28D1/14
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