SEMICONDUCTOR ELEMENT MOUNTING MEMBER, FABRICATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE

摘要

Provided is a semiconductor element mounting member including a substrate, a frame surrounding a semiconductor element mounting portion, a bonding layer for bonding the frame on the upper surface of the substrate, and a lead terminal passing through the bonding layer. The bonding layer is formed by a hardened product of a heat-hardening resin containing epoxy resin, hardening agent, and inorganic filler. The hardened product has glass transfer temperature 130 degrees C or above. The end surface of the bonding layer and the lead terminal define a contact angle ?1, ?2 which are smaller than 90 degrees. The end surface of the bonding layer and the substrate define a contact angle?3 which is smaller than 90 degrees. Provided also are a method for fabricating the semiconductor element mounting member and a semiconductor device obtained by mounting a semiconductor element on the semiconductor element mounting member.