| 摘要 |
A cleaning apparatus for manufacturing a semiconductor is provided to effectively remove foreign materials attached to a package by maximizing interference between the package and a brush. A cleaning apparatus for manufacturing a semiconductor includes a brushing unit. The brushing unit is shaken in a direction perpendicular to a transferring direction of the processing target in order to remove foreign materials attached to the processing target. The brushing unit includes a brush body(310), a brush(320) extended on a longitudinal direction of an upper surface of the brush body, a brush driving unit(330) connected to one side of the brush body, and a guide rail(340) installed at a lower part of the brush body in order to guide the brush body.
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