| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which does not raise cost although a modulus of an excellent article can be improved, since dispersion of plating thickness is suppressed. SOLUTION: The wiring board is manufactured through a preparation process and a wiring layer forming process. In the preparation process, the intermediate product 11 of the wiring board is prepared consisting of a product forming region 28 where a plurality of parts 27 which are to become products are arranged, and a frame 29 surrounding a periphery of the product forming region 28. The frame 29 of the intermediate product 11 has a first edge 21 and a second edge 22 positioned on the opposite side of the first edge 21 across the product forming region 28. A first mesh conductor layer 81 is formed in the first edge 21, and a second mesh conductor layer 82 whose area rate is lower than the first mesh conductor layer 21 is formed in the second edge 22. In the wiring layer forming process, the intermediate product 11 is immersed in an electrolytic plating bath, and pattern plating is performed. Wiring layers 62 and 72 are formed in the part 27 which is to become the product. COPYRIGHT: (C)2007,JPO&INPIT
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