Semiconductor Module and Power Conversion Device

摘要

One method of achieving the above subjects is by connecting a block member 14 , which is connected to the side opposite to that of a semiconductor chip 11 having insulating substrates 12 and 13 connected to the top and bottom of the semiconductor chip 11 , to a block member 15 across an laminated structure constituted by the semiconductor chip 11 and the insulating substrates 12 and 13.