Print medium applying method for manufacturing e.g. capacitor, on printed circuit board, involves producing openings for medium in mold to prepare mold corresponding to required patterns for printing, where mold is made of plastic or metal

摘要

The method involves printing a print medium such as adhesive on a support at openings (42a-42g) of a mold (40), and applying supplementary materials (46a-46d) such as paint in each opening of the mold, where the supplementary materials increase an original thickness (44) of the mold. The openings for the print medium are produced in the mold for preparing the mold corresponding to required printing patterns for printing, where the mold is made of plastic or metal. An independent claim is also included for a mold with openings for applying a print medium on a support.