发明名称 |
Electronic package employing segmented connector and solder joint |
摘要 |
<p>An electronic package is provided having a connector and a solder joint that is less susceptible to thermal fatigue. The package includes a die including a first electrically conductive connecting surface having a first coefficient of thermal expansion and a substrate including electrical circuitry and a second electrically conductive connecting surface having a second coefficient of thermal expansion. The package further includes a solder joint connecting the first connecting surface to the second connecting surface. One of the first and second connecting surfaces includes a plurality of pads spaced from each other. By employing an electrical connection having a plurality of pads spaced from each other, the solder joint is relieved to reduce fatigue caused by thermal cycling.
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申请公布号 |
EP1610381(A3) |
申请公布日期 |
2007.07.11 |
申请号 |
EP20050076420 |
申请日期 |
2005.06.17 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
BRAUER, ERIC A. |
分类号 |
H01L23/498;H01L21/44;H01L21/48;H01L21/50;H01L21/60;H01L23/00;H01L23/02 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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