Composition for ceramic bonding and ceramic bonded article

摘要

The present invention provides a composition for ceramic bonding, which comprises 3-55% by volume of ceramic particles, 1-25% by volume of inorganic binder, and a liquid medium, wherein the composition further contains hollow particles. The invention also provides a ceramic bonded article comprising a ceramic bonding layer formed by applying the composition to a bonding surface of a ceramic molded body and then heating the composition applied.