TEST SOCKET FOR BGA PACKAGE

摘要

A test socket for a BGA(Ball Grid Array) package is provided to minimize the damage of an external connection ball, have a low-inductance structure corresponding to a high frequency, and have self alignment for having the low pollution of the external connection ball and improving fine pitch correspondence and contact alignment. A test socket is formed in a position corresponding to an external connection ball(110) arranged on one surface of a BGA package(100). The text socket includes a probe pin(30) electrically connected with a pitch expansion board(50). The probe pin(30) includes a coil spring(31) and a conductive rubber(35). The coil spring(31) has an inner diameter which is narrower than a diameter of the external connection ball(110). A filament is wound by a certain number to form the coil spring(31). The wiring of one side of the coil spring(31) is contacted with the external connection ball(110), and the wiring of the other side of the coil spring(31) is contacted with a pitch expansion board(50). The conductive rubber(35) surrounds the coil spring(31).