| 摘要 |
A housing for an electronic device is provided to transfer simultaneously a plurality of semiconductor chips without a two-dimensional movement of the semiconductor chip by using a plurality of chip trays composed of upper and lower units. A housing(10) for an electronic device includes one or more chip trays and a storage tray. The chip trays(11) are used for holding a plurality of semiconductor chips. The storage tray(12) is used for storing the chip trays. The chip tray is formed by connecting a lower unit and an upper unit vertically. The upper and the lower units have the same structures. The lower unit is enclosed with the upper unit.
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