RESIN-MADE CASE FOR ELECTRONIC EQUIPMENT AND MANUFACTURING METHOD OF RESIN MOLDING

摘要

PROBLEM TO BE SOLVED: To provide a resin molding which has a simple structure and can dissipate heat efficiently. SOLUTION: The resin molding 20 contains carbon nanotubes 22 arranged so that mutual contact leads to their connection in a specified direction, in a resin substrate 21 in the area receiving heat from a heat-generating part. The simple structure containing carbon nanotubes 22 arranged in a specified direction realizes efficient heat conduction and dissipation. A resin-made case which uses the resin molding and houses electronic equipment 10 having heat-generating parts 12 and 13 can dissipate heat generated inside efficiently to cool the equipment. Carbon nanotubes are preferably arranged so that their longitudinal direction in the resin substrate lies in the front-back direction of the case. COPYRIGHT: (C)2007,JPO&INPIT