| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that is capable of improving connection reliability after mounting a semiconductor element to a printed circuit board, by avoiding concentration of stress to an insulating organic protection film at a place near a bump while obtaining sufficient adhesiveness between an organic insulating film of the semiconductor element and an underfill, and to provide its manufacturing method. <P>SOLUTION: The semiconductor device is provided with a plurality of electrode layers 33 respectively provided at a prescribed position in a semiconductor substrate 31, the organic insulating film 34 formed on the semiconductor substrate 31 while selectively exposing a prescribed region of each electrode layer 33, and a plurality of bump electrodes 39 for external connection respectively formed in the prescribed region of each electrode layer 33. The thickness of the organic insulating film 34 near around each bump electrode 39 for external connection is thicker than the organic insulating film 34 between the bump electrodes 39 for external connection. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
