SPUTTERING TARGET STRUCTURE

摘要

Disclosed is a low-cost sputtering target structure which is excellent in machinability and thermal conductivity, while having good wettability to brazing filler materials. The sputtering target structure can be repeatedly used for a long time and is free from problems such as cracks or separation of the sputtering target. Specifically disclosed is a sputtering target structure obtained by joining a sputtering target with a backing plate, wherein the backing plate is made of a material having a linear expansion coefficient different from that of the sputtering target material by 2 × 10<SUP>-6</SUP> /K or less, and a copper plate having a thickness of 0.3-1.5 mm is arranged on at least one surface of the backing plate.