| 摘要 |
The invention relates to a circuit arrangement comprising a heat exchanging device for heating and/or cooling at least one component, especially an electronic component, and at least one heat transfer duct that is penetrated by a heat exchanging medium. The inventive circuit arrangement (3) further comprises at least one heat pipe (13, 15) for transferring heat within the circuit arrangement (3), said at least one heat pipe (13, 15) being thermally connected to the heat transfer duct (7) in order to thermally treat the component (26). |
