| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor apparatus wherein the thermal resistance is small between a semiconductor device and a cooler and the thermal stress is alleviated between the semiconductor device and the cooler. SOLUTION: This semiconductor apparatus 10 comprises a cooler 20, a polyimide resin layer 30 formed on the cooler 20, a conductive lamination 40 formed on the polyimide resin layer 30, and the semiconductor device 60 installed on the conductive lamination 40. The conductive lamination 40 has a conductive lower layer 42, a conductive middle layer 44, and a conductive upper layer 46. Copper is used in the conductive lower layer 42. Molybdenum is used in the conductive middle layer 44. Copper is used in the conductive upper layer 46. COPYRIGHT: (C)2007,JPO&INPIT |
