发明名称 LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a laminated electronic component with high reliability by reducing capacitance variations so as to effectively preventing flat side cracks caused from flat faces to side faces of the component even when thin dielectric layers are multilayered. SOLUTION: In the laminated electronic component with the number n of laminated layers (n≥100), a relation of 0.4≤Tfe/Tfc≤0.8 holds in each of internal electrode layers from a lower side outer layer to the fifteenth internal electrode layer and internal electrode layers from an upper side outer layer to the fifteenth internal electrode layer, in total 30 layers, wherein Tfe is an average thickness of electrodes at electrode end parts Wfe, Tfc is an average thickness of electrodes at an electrode center part Wfc, and a relation of 0.9≤Tfe/Tfc≤1.0 holds in each of internal electrode layers upper and lower than the n/2-th layer (however, the (n/2+0.5)th layer when n is an odd number) from the lower side outer layer, in total 30 layers. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007173725(A) 申请公布日期 2007.07.05
申请号 JP20050372605 申请日期 2005.12.26
申请人 TDK CORP 发明人 TANAKA HIROBUMI;SATO AKIRA;NAKANO YUKIE
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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