| 摘要 |
Embodiments of the invention provide a multi-chamber semiconductor device fabrication apparatus. The invention provides a multi-chamber semiconductor device fabrication apparatus comprising a transfer chamber, a plurality of outer chambers connected to the transfer chamber, and a wafer handling and cooling mechanism comprising a wafer-cooling blade adapted to support a wafer seated on the wafer-cooling blade. In addition, the wafer handling and cooling mechanism is adapted to transfer the wafer seated on the wafer-cooling blade from an interior of the transfer chamber to a first outer chamber during a transfer period, and the wafer-cooling blade is adapted to actively cool the wafer seated on the wafer-cooling blade during the transfer period.
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