发明名称 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING POSITIVE RESIST COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition for use in the production process of a semiconductor such as IC, in the production of a circuit substrate of liquid crystal, thermal head and the like or in other photofabrication processes, the positive resist composition being capable of satisfying all of exposure latitude (EL), scum reduction and profile on a higher level, and a pattern forming method using the positive resist composition. <P>SOLUTION: The positive resist composition comprises (A) a resin containing a repeating unit (A1) having a lactone structure and a cyano group, and having solubility in an alkali developer increased by the action of an acid, (B) a compound capable of generating a fluorine substituted 2 or 3C alkanesulfonic acid upon irradiation with an actinic ray or radiation, and (C) a solvent. The pattern forming method using the positive resist composition is also provided. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007171820(A) 申请公布日期 2007.07.05
申请号 JP20050372511 申请日期 2005.12.26
申请人 FUJIFILM CORP 发明人 IWATO KAORU;KODAMA KUNIHIKO
分类号 G03F7/039;H01L21/027 主分类号 G03F7/039
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