发明名称 |
RADIATION-CURABLE LIQUID RESIN COMPOSITION FOR ADHESIVE AGENT AND BONDING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a radiation-curable liquid resin composition for an adhesive agent excellent in adhesiveness. SOLUTION: The radiation-curable liquid resin composition for an adhesive agent comprises based on 100 mass% of the total amount of the composition: (A) 5-30 mass% of a urethan (meth)acrylate with 4,000 or less of a molecular weight; (B) 60-95 mass% of a radically polymerizable compound; and (C) 0.1-10 mass% of a photo polymerization initiator. (A) component may comprise a urethan (meth)acrylate having a polyisocyanate origin structure having a cycloaliphatic structure and a hydroxy group-containing (meth)acrylate origin structure. COPYRIGHT: (C)2007,JPO&INPIT
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申请公布号 |
JP2007169580(A) |
申请公布日期 |
2007.07.05 |
申请号 |
JP20050381197 |
申请日期 |
2005.12.22 |
申请人 |
JSR CORP |
发明人 |
TONSHO SHINJI;SUGIMOTO MASANOBU;KUROSAWA TAKAHIKO |
分类号 |
C09J175/04;C08F290/06;C09J4/00;C09J11/06;C09J175/14 |
主分类号 |
C09J175/04 |
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