EPOXY RESIN COMPOSITION

摘要

The present invention relates to an epoxy resin composition, in particular, to an epoxy resin composition suitable for use as an encapsulation agent for electrical parts such as drive- ICs mounted on a circuit board. The epoxy composition is a liquid phase at room temperature and includes 100 parts by weight of an epoxy resin having 2 or more glycidyl groups in the molecure, 10-50 parts by weight of a reactive diluent having one or more glycidyl groups in the molecure, 50-200 parts by weight of an anhydrous curing agent which is a liquid phase at room temperature with respect to 100 parts by weight of the epoxy resin and the reactive diluent, and 1-20 parts by weight of a latent curing accelerator with respect to 100 parts by weight of the epoxy resin, the reactive diluent, and the anhydrous curing agent, and whose viscosity at 25 °C is 250-500cps, gelation time at 150°C is below 120 seconds.