| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering palette with uniformity and high quality to which flow soldering can be performed. SOLUTION: A soldering palette 1 is used when soldering a lead 33 of electronic components 32a and 32b projected at the rear surface of a printed circuit board 34, while the electronic components 32a and 32b are arranged on the surface of the printed circuit board 34. The soldering palette comprises a placing part 40 wherein the printed circuit board 34 is placed, openings 2 and 3 formed in a part to be soldered, and a solder abutment adjusting member 4 for covering the opening 3. COPYRIGHT: (C)2007,JPO&INPIT |
