发明名称 SOLDERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a soldering apparatus capable of quickly soldering for stable soldering quality. SOLUTION: The soldering apparatus includes a soldering bit 4 formed in collet to hold a part 2 to be soldered, a heater 5 provided in the soldering bit 4, a guide member 7 which allows the soldering bit 4 to be inserted while movable in axial direction and slides on a tapered surface 6 around the soldering bit 4, and a soldering bit driving means 8 which moves the guide member or the soldering bit 4 in axial direction to expand/shrink the soldering bit 4. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007173376(A) 申请公布日期 2007.07.05
申请号 JP20050366534 申请日期 2005.12.20
申请人 HITACHI CABLE LTD 发明人 OTOMO KENJI
分类号 H05K3/34;B23K3/02;B23K101/42 主分类号 H05K3/34
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