| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state imaging device where embedding property of a transparent film to an opening of a waveguide is improved and condensing property is improved, and to provide a method of manufacturing the device and a camera. SOLUTION: The solid-state imaging device includes a light receiver 22 formed in a semiconductor substrate 20; conduction layers M1 and M2 formed on an upper layer of the semiconductor substrate 20; interlayer dielectrics 31 to 33 which cover the conduction layers M1 and M2 and the semiconductor substrate 20, and which have the opening 50 of the waveguide on the light receiver 22; and the transparent film 51 which is buried in the opening part 50 of the interlayer dielectrics 31 to 33 and is formed. An etching stopper film 40 is formed in a part of a surface of the conduction layer M1 at a periphery of the light receiver 22. COPYRIGHT: (C)2007,JPO&INPIT
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