| 摘要 |
A semiconductor package is disclosed including test pads formed of solder bumps affixed to the semiconductor package during fabrication. When the package is encapsulated, due to the pressure exerted on the package during the encapsulation process, portions of the solder bumps get flattened out to be generally flush with and exposed on a surface of the semiconductor package. These exposed portions of the solder bumps form the test pads by which the finished package may be tested.
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