摘要 |
<p>Provided herein are hardmask compositions for resist underlayer films, wherein according to some embodiments of the invention, hardmask compositions include a polymer prepared by the reaction of a compound of Formula 1 with a compound of Formula 2 in the presence of a catalyst, whereinisa monovalent organic group, n is an integer from 3 to 20, and m is 1 or 2; and an organic solvent. Also provided herein are methods for producing a semiconductor integrated circuit device using a hardmask composition according to an embodiment of the invention. Further provided are semiconductor integrated circuit devices produced by a method embodiment of the invention.</p> |
申请人 |
CHEIL INDUSTRIES INC.;UH, DONG SEON;OH, CHANG IL;KIM, DO HYEON;YUN, HUI CHAN;LEE, JIN KUK;NAM, IRINA;KIM, JONG SEOB |
发明人 |
UH, DONG SEON;OH, CHANG IL;KIM, DO HYEON;YUN, HUI CHAN;LEE, JIN KUK;NAM, IRINA;KIM, JONG SEOB |