| 摘要 |
Provided are a conductive fine particle for connecting electrodes, a novel method for preparing the conductive fine particle without pretreatment such as etching, surface sensitizing, etc., and an anisotropic conductive adhesive composition containing the conductive fine particle. The conductive fine particle comprises: a resin-based fine particle; and a metal coating layer formed by electroless plating, wherein a functional group having the chemical affinity to the metal coating layer is introduced on the surface of the resin-based fine particle. Preferably the functional group introduced on the surface of the resin-based fine particle is -SH, and the metal coating layer has a thickness of 0.02-05 micrometers.
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