发明名称 SHEET FOR CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND CHIP BURIED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a sheet for circuit board with which a circuit board where a circuit chip is buried for controlling respective pixels for display can efficiently be manufactured with sufficient quality and high productivity, and to provide the chip buried circuit board. SOLUTION: The sheet for circuit board is formed of an energy line curing polymeric material for burying the circuit chip. A plurality of recessed grooves opened to both ends are formed on a surface of a side where the circuit chip is buried in a non-curing layer formed of the energy line curing polymeric material. In the chip buried circuit board, the circuit chip is buried in the non-curing layer formed of the energy line curing polymeric material in the sheet for circuit board, and the chip is irradiated with an energy line so as to cure it. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007173380(A) 申请公布日期 2007.07.05
申请号 JP20050366626 申请日期 2005.12.20
申请人 LINTEC CORP 发明人 NAKABAYASHI MASAHITO;IZUMI TADASHI
分类号 H05K1/16;H05K1/18 主分类号 H05K1/16
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