发明名称 Thermoplastic resin composition with low coefficient of linear thermal expansion
摘要 The present invention relates to polymeric materials. More particularly, the present invention relates to a thermoplastic resin composition, a method of making a thermoplastic resin composition and an article made from a thermoplastic resin composition.
申请公布号 US2007155898(A1) 申请公布日期 2007.07.05
申请号 US20060598541 申请日期 2006.11.13
申请人 NA HEE S;KIM TAE U 发明人 NA HEE S.;KIM TAE U.
分类号 C08L51/00;C08L25/12;C08L51/04;C08L55/02 主分类号 C08L51/00
代理机构 代理人
主权项
地址