| 摘要 |
A probe member, a probe card and a wafer inspection apparatus by which a good electrical connection state is attained surely, positional shift due to temperature variation is prevented and a good electrical connection state is sustained stably even for a wafer having a diameter of 8 inch or above and arranged with electrodes to be inspected at an extremely small pitch. The probe member comprises a metallic frame plate having openings, and a plurality of contact films supported on the surface thereof and disposed to close the openings. The contact film comprises a sheet-like probe where a plurality of electrode structures are arranged on a flexible insulating film, a frame plate having a plurality of openings, and an anisotropic conductive connector composed of a plurality of elastic anisotropic conductive films supported on the frame plate and disposed to close one opening respectively, and arranged on the rear surface of the sheet-like probe, wherein the opening in the frame plate of the sheet-like probe is large enough to receive the outline of the anisotropic conductive connector in he plane direction of the frame plate.
|
