| 摘要 |
An electrode for etching a wafer is provided to prevent an adhesive from being burnt due to a gas and to prevent a support ring from being damaged by forming a coating layer on a surface of the support ring of the electrode, thereby preventing wafer defects. A surface erosion prevention structure of an electrode for etching a wafer includes an electrode distribution plate(102) on which plural distribution holes(103) are formed, induction holes(104) formed corresponding to the distribution holes, a support plate(101) on which an interposing part for a support bolt(110) is formed, and a bush(111) inserted into the interposing part to prevent a damage of the support plate. A coating layer(150) is formed on the support plate to prevent a surface of the support plate from being damaged.
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