SUBSTRATE CLAMP OF SPUTTER AND SUPTTER METHOD

摘要

A substrate clamp of a sputter chamber is provided to enable a more stable sputtering process by more stably gripping a substrate without causing damage like scratch to the substrate. A substrate placed on a susceptor is fixed by a substrate clamp(110) of a sputtering chamber. The substrate clamp includes at least one pressurizing plate(112) installed along the edge of the susceptor corresponding to the outer part of the substrate. The pressurizing plate obliquely descends to press and fix the end of the substrate while maintaining horizontality, and obliquely ascends in a manner that goes away from the substrate so as to unfix the substrate. The end of the pressurizing plate confronting the substrate is slanting toward the substrate.