发明名称 Apparatus and method of dispensing photosensitive solution in semiconductor device fabrication equipment
摘要 A method of and apparatus for dispensing photosensitive solution substantially reduces the amount of air bubbles in the photosensitive solution during the dispensing operation. The photosensitive solution dispensing apparatus includes at least one supply vessel that contains the solution, a respective buffer tank that buffers the solution supplied from each supply vessel, a filter unit for filtering the solution, a pump for pumping the solution pumped from the buffer tank to the filter unit, a dispensing nozzle connected to the filter unit, and a dedicated bubble removal filter that is interposed between the buffer tank and the pump. The bubble removal filter is configured to remove air bubbles from the solution before the solution flows into the pump and is dispensed through the nozzle.
申请公布号 US7237581(B2) 申请公布日期 2007.07.03
申请号 US20050045062 申请日期 2005.01.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JANG SUNG-KUN
分类号 B65B1/04;H01L21/027;G03F7/16;H01L21/00 主分类号 B65B1/04
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