| 摘要 |
Provided is a polyphenylene ether-based thermoplastic resin composition, which has improved impact resistance while maintaining mechanical properties unique to a polyphenylene ether resin, and is useful for producing injection molded products for electric and electronic appliances. The polyphenylene ether-based thermoplastic resin composition comprises: (A) 30-80 parts by weight of a polyphenylene ether resin; (B) 20-70 parts by weight of a rubber-modified polystyrene resin; and (C) 1-20 parts by weight of an ethylene/alkylene (meth)acrylate copolymer represented by the following formula 1, based on 100 parts by weight of the combined weight of (A)+(B). In formula 1, R_1 is H or CH_3; R_2 is H or a C1-C12 alkyl; each of m and n represents a polymerization degree, and m:n is 300:1-10:90. The copolymer of formula 1 has a melt index of 0.01-40g/10 min. at 190 deg.C under 2.16 kgf.
|
