发明名称 CONDUCTIVE CURABLE COMPOSITIONS
摘要 Conductive curable compositions contain a free radical polymerizable monomer, oligomer or polymer (i); an organoborane amine complex (ii), and an electrically or thermally conductive filler (iii). The conductive curable compositions can also contain an amine reactive compound having amine reactive groups (iv); and (v) a component capable of generating a gas when mixed with a compound bearing active hydrogen and a catalyst. The electrically conductive curable compositions can be used in composite articles of manufacture in which substrates are coated or bonded together with the composition and cured; and as electrically conductive rubbers, electrically conductive tapes, electrically conductive adhesives, electrically conductive foams, and electrically conductive pressure sensitive adhesives. The thermally conductive compositions can also be used in composite articles of manufacture in which substrates are coated or bonded together with the composition and cured, and as thermal interface materials, thermally conductive rubbers, thermally conductive tapes, thermally conductive adhesives, thermally conductive foams, thermally conductive seals and gaskets, and thermally conductive pressure sensitive adhesives.
申请公布号 KR20070070188(A) 申请公布日期 2007.07.03
申请号 KR20077009491 申请日期 2005.10.04
申请人 DOW CORNING CORPORATION 发明人 AHN, DONG CHAN;FISHER MARK DAVID;MOJICA ANDREW ANTHONY
分类号 C08K5/55;C08K5/17;C08L83/00 主分类号 C08K5/55
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