| 摘要 |
Disclosed is a polishing composition for silicon wafers which enables to prevent metal contamination, in particular copper contamination, in polishing of silicon wafers. Specifically disclosed is a polishing composition for silicon wafers containing silica, a basic substance, at least one compound selected from amino acid derivatives represented by the formula (1) and formula (2) below and salts thereof, and water. (1) (In the formula (1), R1, R2 and R3 may be the same or different, and respectively represent a hydroxyl group, a carboxyl group, a phenyl group or an alkylene group having 1-12 carbon atoms which may be substituted by an amino group.) (2) (In the formula (2), R4 and R5 may be the same or different, and respectively represent a hydrogen atom, a hydroxyl group, a carboxyl group, a phenyl group or an alkyl group having 1-12 carbon atoms which may be substituted by an amino group. In this connection, R4 and R5 are not hydrogen atoms at the same time. R6 represents a hydroxyl group, a carboxyl group, a phenyl group or an alkylene group having 1-12 carbon atoms which may be substituted by an amino group.)
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