| 摘要 |
An electrolytic plating system of a casting mold is provided to secure good plating quality for the casting mold by restraining an electric current from concentrating in corners of the casting mold and making it not necessary to form a thick plating layer on the corners of the casting mold, thereby controlling thickness of the plating layer as a whole. In a plating apparatus comprising an anode(11') to which a metal to be plated is connected, a cathode connected to a casting mold(R) as a plating object, and a plating pot(12) in which a plating solution(13) is contained such that the anode and the cathode are installed in the plating solution, an electrolytic plating system of the casting mold is characterized in that the plating object is a casting mold comprising a casting mold side part(14) and a casting mold copper part(15), the casting mold copper part has a casting mold outer peripheral surface portion(15') and a casting mold side face portion(15"), and the anode has a length shorter than width of the casting mold copper part. The anode has the length that is 1/2 or more of the width of the casting mold copper part.
|
