| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an exposure system for forming a solder resist with high accuracy and favorable shape stability and to provide a method of manufacturing a printed wiring board. <P>SOLUTION: The exposure system is equipped with: a receiving means which receives input of design data of the layout position of a conductive pattern and design data of the layout position of a solder resist; a computing means which forms a contour of a portion where the solder resist is to be formed, a contour of a portion where the conductive pattern is to be formed, and a contour of a portion where the solder resist and the conducive pattern overlap; a discriminating means which discriminates a portion where the solder resist is formed with the conductive pattern at a lower part, a portion where the solder resist is formed without the conductive pattern at the lower part, and a portion where no solder resist is formed based on the formed contour; and an exposure means which exposes the solder resist while adjusting the exposure amount for each portion. The method of manufacturing a printed wiring board is carried out by using the above system. <P>COPYRIGHT: (C)2007,JPO&INPIT |
